VisualSim Architect accelerates semiconductor design by providing a unified SoC modeling and simulation platform.

It enables engineers to explore architecture trade-offs across compute, memory, NoC, chiplets, design interconnect topology using AMBA, Tilelink, Corelink, Arteris, Crossbar and custom solution, and interfaces with chiplets and other systems using UCIe, PCIe, and CXL, before RTL or silicon. With an extensive semiconductor modeling library, architects can explore high-fidelity models in days, share them in encrypted form as reference designs, and reduce both risk and time-to-market.

VisualSim’s Role in Semiconductor Design

VisualSim is a system-level architecture exploration tool for:

ARM-based SoCs
Cortex-A/R/M, Neoverse, Mali GPUs, AMBA buses, CoreLink/CMN interconnects.

Non-ARM SoCs
RISC-V, PowerPC, Tensilica DSP, TI DSP, Synopsys ARC.

Custom/Domain-Specific SoCs
PCIe switches, Infotainment, Autonomous vehicles, CXL memory expanders, AI accelerators, networking ASICs.

Engineers can model end-to-end SoC behavior — CPUs, accelerators, cache hierarchies, NoCs, memory controllers, DDR/LPDDR/GDDR/HBM, and chiplet interconnects — to optimize latency, throughput, bandwidth, power, and area trade-offs.

Benefits for Engineers

Rapid Trade-off Analysis

Compare core counts, cache levels, and interconnect topologies in days, not months.

Performance & Power Profiling

Measure throughput, latency, utilization, and energy at system level.

Chiplet & UCIe Exploration

Evaluate disaggregated systems with real die-to-die traffic.

Reference Model Sharing

Distribute encrypted models to OEMs for integration without exposing IP.

Multi-Domain Simulation

Co-simulate RF, mechnical, thermal, power and digital for realistic validation.

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Benefits for Management

Faster Time-to-Market
Catch performance bottlenecks and reduce power consumption before RTL.

Lower Risk
Avoid late-stage redesigns caused by unverified assumptions.

Customer Co-Design
Engage OEMs early with usable encrypted models.

Optimized Cost & Power
Data-driven component selection to meet Power-Performance-Area (PPA) goals.

Unique Capabilities

Chiplet & UCIe Modeling
Simulate heterogeneous chiplets and traffic across dies.

Flexible NoC/Interconnect Support
Mesh, ring, hierarchical, or custom topologies. SUpport commercial vendor and custom technology

Memory System Design
LPDDR5-X, DDR5, GDDR6, HBM2/3 with real controller behavior.

Parameterized Libraries
Ready-to-use CPUs, GPUs, DSPs, NPUs, controllers, and buses from most of the major IP vendors.

Encrypted Model Sharing
Provide OEMs with reference SoC models while protecting IP.

Success Stories

Networking SoC Vendor
Cut interconnect evaluation time by 70%.

AI Accelerator Startup
Boosted inference throughput by 30% through early architecture tuning.

Chiplet Processor Company
Avoided costly redesign by modeling UCIe latency and power upfront.

Use Cases

Neoverse SoC

Evaluate cluster performance for AI inference.

RISC-V Vision SoC

Balance CPU/DSP/NPU resources for automotive workloads.

Custom PCIe Switch

Optimize routing, QoS, arbitration, buffering, and packet delay.

Chiplet AI Accelerator

Optimize memory assignment, distribution of tasks and I/O chiplets to meet PPA.

CXL Memory Expansion

Analyze cache coherence and bandwidth scalability.

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