Visit Mirabilis Design at Chiplet Summit 2026 — Booth 314
January 25, 2026
The global semiconductor industry is rapidly embracing chiplet-based architectures, heterogeneous integration, high-bandwidth die-to-die fabrics, and system-level co-design. As design complexity increases, engineering teams across compute, networking, AI accelerators, RF, memory, and advanced packaging are demanding faster ways to explore architectures, evaluate trade-offs, and validate system performance before any RTL or silicon investment. At this year’s […]
